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荷声科技（SonoSilicon)：片上超声技术创领者

杭州荷声科技有限公司于2023年3月成立于西子湖畔。作为一家中欧合资企业，荷声总部设在中国杭州，并在荷兰代尔夫特设有全资子公司。

荷声科技专注于微型片上超声模组与系统的研发与创新，以十五年跨国研发沉淀为根基，通过整合先进集成电路、硅基超声换能器与多维超声成像技术，为未来医疗超声带来变革，同时以开拓者姿态推动革命性产品的研发与落地。

荷声科技——以专业驱动创新，赋能下一代超声未来。

创始团队

陈超博士

Chao Chen is the Founder and CEO of Sonosilicon. He holds a Ph.D. and a M.Sc. degree from Delft University of Technology, and a B.Sc. degree from Tsinghua University, all in microelectronics. Prior to launching Sonosilicon, he was a Senior/Principal Engineer with Butterfly Network, Inc., where he worked within an industry-leading start-up team and brought the world’s first CMUT-on-CMOS ultrasound-on-chip to volume production. Dr. Chao has spent his last 12 years empowering next-generation ultrasound applications, from interventional, handheld to wearable, with cutting-edge engineering innovations in semiconductors and electronics.

Dr. Chen currently serves as a member of the technical program committees of the European Solid-State Electronics Research Conference (ESSERC). He was a recipient of the 2017 IEEE IUS Best Student Paper Award and the 2019 Else Kooi Award. He was a co-recipient of the 2021 ISSCC Anantha P. Chandrakasan Distinguished-Technical-Paper Award and Demonstration Award, the 2020 ISSCC Technology Innovation Award, and the 2017 A-SSCC Best Student Paper Award.

Dr. Michiel A.P. Pertijs

Michiel serves as a Scientific Advisor to Sonosilicon. He is an Associate Professor at Delft University of Technology, where he heads a research group focusing on integrated circuits for next-generation ultrasound applications. Founded by alumni from Michiel’s group, Sonosilicon builds on the expertise gained in 15 years of research in this field.

Prior to his academic career, Michiel held R&D positions in the semiconductor industry. He has authored or co-authored two books, four chapters, 15 patents, and over 170 technical papers. He is a member of the technical program committees of the European Solid-State Electronics Research Conference (ESSERC) and the IEEE International Ultrasonics Symposium (IUS). He also served on the program committees of the International Solid-State Circuits Conference (ISSCC) and the IEEE Sensors Conference, and as an Associate Editor for the IEEE Journal of Solid-State Circuits (JSSC). He received several awards, including the ISSCC 2005 Jack Kilby Award, the JSSC 2005 Best Paper Award, and the 2014 and 2023 Best Teacher Award of the EE program at Delft University of Technology.

檀明亮博士

Mingliang is a Co-founder and Ultrasound IC Architect at Sonosilicon. He holds a Ph.D. degree in microelectronics from Delft University of Technology. Mingliang focused on the design of mixed-signal front-end application-specific integrated circuits (ASICs) for advanced ultrasound imaging probes and applications, including forward-looking (FL) intravascular ultrasound (IVUS) imaging probe, intra-cardiac echocardiography (ICE) probe, and wearable ultrasound patch. With the innovations in terms of system design and circuit implementation, his research has demonstrated the first fully digital FL-IVUS probe and the first CMUT-based wearable ultrasound patch. At Sonosilicon, he focuses on defining innovative circuit and system solutions for next-generation ultrasound imaging devices.

Dr. Yannick Hopf

Yannick is a Co-Founder and Ultrasound IC Architect at Sonosilicon. He holds a Ph.D. degree in electrical engineering from Delft University of Technology and a M.Sc. degree from the Technical University of Darmstadt, being honored with the 2023 SSCS Predoctoral Achievement Award and the Eckelmann AG Prize for the best degree in his year.

Yannick focused on the intersection of application-specific integrated circuits (ASICs) and ultrasound imaging, driving ultrasound frontend architectures from idea to verification, ultimately leading to the demonstration of the first high-frame-rate 3D intracardiac echocardiography (ICE) concept. At Sonosilicon, he leads the Netherlands-based team, applying innovative circuit and system solutions to empower the next generation of ultrasound devices.